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Sensata : Sensata LGA(BGA)封装测试座/老化座LGA(BGA) Test &Burn-

Sensata LGA封装测试座/老化座LGA Test Burn-in socket 1、插装型1mm和1.27mm间距 单位:mm 产品型号 (Part Number) 间距(Pitch) 引脚数量(Pin Count) 封装芯片尺寸 (Body Size) 插座外形尺寸 (Socket Dimensions) 长度 宽度...

Sensata : Sensata BGA封装测试座/老化座BGA Test &Burn-in socket

Sensata BGA封装测试座/老化座BGA Test Burn-in socket 机械特性: Contact system: normally closed Package insertion force: ZIF Contact Force: Approximately 18g/pin typ; 1521 g/pin range Durability: 10,000 cycles min. Temperature range: -55C...

Sensata : Sensata QFP封装测试座/老化座QFP Test &Burn-in socket

Sensata QFP封装测试座/老化座QFP Test Burn-in socket 特点: Insulator PEI (glass filled) Contact Beryllium copper Plating Gold over nickel Insulation Resistance 1,000 M ohm minimum at 500 VDC Withstanding Voltage 100700 VAC for 1 minute Con...

Sensata : Sensata SOP封装测试座/老化测试座SOP Test &Burn-in s

Sensata SOP封装测试座/老化座SOP Test Burn-in socket 特点: Current Rating Max. 1 Amp Insulation Resistance Min. 1,000 M ohm Dielectric Strength AC 700 V-RMS / 1 Min Initial Contact Resistance Max. 30m ohm at DC 10mA Operating Temperature -...
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